SURFACE MOUNT

Product Designation
Description
Typical Application/Benefit
Application Method
Electrical Resistance
Ohms - cm
Silver Epoxy Adhesives
DB-1501
Silver epoxy, 1 component
SMD attachments, high shear strength, long stencil life
Stencil Print
0.0004 ohm-cm
DB-1509
Silver epoxy, 2 component
SMD attachments, high shear strength, long stencil life
Stencil Print
0.0004 ohm-cm
DB-1561
Silver epoxy, 2 component
SMD attachment, low temp cure
Needle Dispense
0.003 ohm-cm
Under-fill Staking Compounds
UF-9526
Non-conductive under fill adhesive
SMD attachments, long dispense life
Needle Dispense
> 1,000 Mega Ohm
Encapsulant
EC-9519
Non-conductive UV cure encapsulant
SMD top coat for protection
Needle Dispense
> 1,000 Mega Ohm