SURFACE MOUNT
Product Designation |
Description |
Typical Application/Benefit |
Application Method |
Electrical Resistance Ohms - cm |
|
| Silver Epoxy Adhesives | |||||
DB-1501 |
Silver epoxy, 1 component |
SMD attachments, high shear strength, long stencil life |
Stencil Print |
0.0004 ohm-cm |
|
DB-1509 |
Silver epoxy, 2 component |
SMD attachments, high shear strength, long stencil life |
Stencil Print |
0.0004 ohm-cm |
|
DB-1561 |
Silver epoxy, 2 component |
SMD attachment, low temp cure |
Needle Dispense |
0.003 ohm-cm |
|
| Under-fill Staking Compounds | |||||
UF-9526 |
Non-conductive under fill adhesive |
SMD attachments, long dispense life |
Needle Dispense |
> 1,000 Mega Ohm |
|
| Encapsulant | |||||
EC-9519 |
Non-conductive UV cure encapsulant |
SMD top coat for protection |
Needle Dispense |
> 1,000 Mega Ohm |
|