SOLAR MODULES

Product Designation
Description
Resistivity
(ohm*cm)
Tg (˚C)
Tan Delta
Viscosity
cP (5.0s-1)
Application
Method
Conductive Ribbon/Stringer Attach Adhesives
DB-1538-2
2 part, flexible, 2 min @180˚C cure
2 x 10-4
50
11,000
Dispense
DB-1541-S
Best damp heat conductivity stability on Sn and tin-silver ribbon, flexible, high peel strength
2 x 10-4
8
22,000

Dispense

DB-1541-S3
Lower silver content (lower cost) than DB-1541-S with same reliability, conductivity
1 x 10-4
0
10,000
Dispense
DB-1548-1
High shear strength, moderate Tg Conductivity stability on tin and tin-silver ribbon
3 x 10-4
60
10,000
Dispense
CA-100
High Tg conductive adhesive developed for glass backed thin film stringing applications. Good damp heat stability on molybdenum
4 x 10-4
110
20,000
Dispense
Low Cost Conductive Adhesives
DB-1590
Low cost, fast/snap cure. Designed for ribbon stringing for crystralline silicon or thin film cells
2 x 10-4
15
20,000
Dispense
DB-1548-LC
Low cost version of DB-1548 series
9x 10-4
62
30,000
Dispense
Low Temperature Cure Conductive Adhesives
DB-1541-LTC
Low temperature cure version (100C) for organic PV and other temperature sensitive modules
2 x 10-4
50
17,000
Dispense
Conductive Adhesives for Back Contact Applications
DB-1541
Flexible, high peel strength, Damp heat stability on tin and OSP treated copper. Designed to cure during EVA lamination
1 x 10-4
13
33,000
Stencil Print
DB-1588
Low cost, flexible, excellent damp heat performance on OSP treated copper. Same chemistry as DB-1541
4 x 10-4
5
30,000
Stencil Print
DB-1588-1
Lowest cost, flexible, excellent damp heat performance on OSP treated copper. Same chemistry as DB-1588
4 x 10-4
5
30,000
Stencil Print
Conductive Grid Inks
CI-1031-7
High thixotropy high aspect ratio / fine line print
1.5 x 10-5
75
20,000
Screen Print
CI-1031-8
Low thixotropy Easiest to print
1.5 x 10-5
75
12,000
Screen Print
CI-1031-9
Low cost filler
2.5 x 10-5
80
17,000
Screen Print