COPPER FLEX CIRCUITS
Product Designation |
Description |
Typical Cure |
Electrical Resistance Ohms/Sq/Mil |
CI-1031-7 |
Silver thermoset ink, highly conductive for silver jumpers or EMI/RFI printed shield pattern |
10 Min. @ 300°F |
<0.010 |
CI-2002 |
Carbon ink for jumpers, resistors, shunts, or copper top-coat |
10 Min. @230° F. |
<20.0 |
DB-1501 |
One component stencil print silver adhesive |
<6 Min @285° F |
0.0004 ohm-cm |
DB-1527 |
Two component needle dispense silver SMT adhesive |
5 Min @ 120° C |
0.003 ohm-cm |
DI-7008 A/B |
Solvent based dielectric |
5-10 Min. @ 230°F |
>1,000 Mega ohms |
DI-7503 |
Flexible UV curable dielectric |
450 millijoules per Square Centimeter |
>1,000 Mega ohms |
EC-9519 |
UV curable encapsulant, flexible |
450 millijoules per Square Centimeter |
>1,000 Mega ohms |